Low-Volume Over Moulding
Whether it’s extra-protection for fragile componentry, or to add rubberised characteristics to your substrates, our over moulding solutions provide an alternative and more cost-effective solution.
Over Moulding
Enhanced Protection
Our polyamide-based solutions form a robust barrier around electrical components, protecting them from moisture, dust, chemicals, and mechanical damage. This added layer of protection ensures the longevity and reliability of the components in various environments.
Enhanced Protection
Cost-Effective
Designed for low-volume production, our solutions offer a cost-effective overmoulding solution without compromising on quality. This makes it ideal for small to medium-sized manufacturers looking to manage production costs while maintaining high standards.
Cost-Effective
Low-Pressure Solution
Many other processes require high-pressure chambers or environments to efficiently seal componentry. Our solution is a low-pressure process that allows for lower cost tooling and prevents damage to fragile components.
Low-Pressure Solution
Superior Insulation
With upper heat resistance of 135°C (286°F) and lower temperature flexibility of -35°C (30°F), our Overtec compound acts as an excellent electrical insulator with good thermal durability in warm and cold environments.
Superior Insulation
Protecting electronics with Tecbond
Overtec is the perfect solution for low-volume, cost-effective overmoulding of electrical components. Its superior protection, flexibility and thermal resistance make it an invaluable asset for manufacturers.
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Tecbond 7786 – Overmoulding Adhesive
- Bonds PVC and ABS plastics
- Excellent high temperature resistance up to 145°C
- Provides a seal against dust, moisture and chemicals
Tecbond 7786 is a polyamide hot melt adhesive specifically designed with class-leading high and low temperature resistances.
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