Skip to main content
Markets & Applications

Low-Volume Over Moulding

Whether it’s extra-protection for fragile componentry, or to add rubberised characteristics to your substrates, our over moulding solutions provide an alternative and more cost-effective solution.
Over Moulding

Enhanced Protection

Our polyamide-based solutions form a robust barrier around electrical components, protecting them from moisture, dust, chemicals, and mechanical damage. This added layer of protection ensures the longevity and reliability of the components in various environments.
Enhanced Protection

Cost-Effective

Designed for low-volume production, our solutions offer a cost-effective overmoulding solution without compromising on quality. This makes it ideal for small to medium-sized manufacturers looking to manage production costs while maintaining high standards.
Cost-Effective

Low-Pressure Solution

Many other processes require high-pressure chambers or environments to efficiently seal componentry. Our solution is a low-pressure process that allows for lower cost tooling and prevents damage to fragile components.
Low-Pressure Solution

Superior Insulation

With upper heat resistance of 135°C (286°F) and lower temperature flexibility of -35°C (30°F), our Overtec compound acts as an excellent electrical insulator with good thermal durability in warm and cold environments.
Superior Insulation

Protecting electronics with Tecbond

Overtec is the perfect solution for low-volume, cost-effective overmoulding of electrical components. Its superior protection, flexibility and thermal resistance make it an invaluable asset for manufacturers.

Ask an expert

Interested in our products? Let us help you discover what you need. Simply fill out the form below and one of our adhesive experts will be in contact with you.