Underfloor voids

Our filling compound, although primarily a repair compound for knots and other forms of wood damage, has strong adhesive properties that make it the ideal solution for filling voids and securing sections of flooring to underfloor substrates.

Requiring a single pilot hole and a hot melt glue gun, our solution removes the fuss associated with putties and epoxies more commonly used for these applications. After application, the area needs little more than planing and sanding before the final finish is applied.