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Tecbond 7786

High Temperature Resistant Adhesive

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Tecbond 7786 is a polyamide hot melt adhesive specifically designed with class-leading high and low-temperature resistance. Predominantly used for product assembly applications in the electronics industry, Tecbond 7786 provides excellent bonds on light gauge metals, PCBs, and many plastics such as PVC and ABS.

Coupled with its high and low-temperature resistance, Tecbond 7786 has a very high molten tack that provides an almost instant grab upon substrate compression.

We recommend that Tecbond 7786 be kept in its original packaging out of direct sunlight to ensure maximum shelf life.

Sizes (mm):

12, 15

Categories :

Industrial & Manufacturing, Product Assembly

Chemistry:

Polyamide

Open time:

<10 seconds

Application temp:

180-215°C

Viscosity / cPs – Adhesive:

4800 @ 190 °C

Softening point:

155°C

Heat resistance:

145°C

Low temp:

-40°C

Colour:

Black

Tecbond 7786

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