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Markets & Applications

Potting & Encapsulating

Bringing flexibility along with strength and security to encapsulation, our hot melt grades are the premium product for protecting sensitive electrical equipment.
Electrical Safety

Superior Protection

Hot melt adhesives provide a robust barrier against contaminants, ensuring the longevity and reliability of electronic components. Their excellent insulating properties safeguard against electrical interference and short circuits.
Superior Protection

Flexibility and Durability

Our encapsulation adhesives remain flexible after setting, allowing for thermal expansion and contraction without cracking or losing adhesion. This flexibility is vital for componentry that experiences consistent movement that may loosen wires or soldering points.
Flexibility and Durability

Low Viscosity for Complete Coverage

Low viscosity formulations contribute to increased coverage and flow, allowing permeation into intricate components and into small crevices. This ensures complete coverage and a uniform protective layer, crucial for the effectiveness of potting and encapsulating applications.
Low Viscosity

User-Friendly

Tecbond hot melts are solvent-free with no volatile organic compounds (VOCs), making them an environmentally and operator friendly choice for potting and encapsulating. When partnered with the range of Tec applicators, they’re simple to use and dispense.
User-Friendly

Break away from expensive encapsulations

Tecbond adhesives are an indispensable solution for potting and encapsulating electrical components, offering superior protection, efficient application, and excellent adhesion. Their flexibility, low viscosity, and environmental benefits make them a top choice for manufacturers seeking reliable and effective encapsulation methods.

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