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Tecbond 7785 is a polyamide adhesive designed for product assembly and some specialist packaging applications. The adhesive works best on wood and fabric but has also proven excellent for bonding most metals and many composite plastics. 7785 can also be used as an encapsulation compound for protecting fragile electronics.
Capable of being subjected to temperatures as high as 135°C and as low as -10°C, Tecbond 7785 is one of the most versatile adhesives in the Tecbond range. This heat resilience, coupled with its class-leading chemical resistance and encapsulation properties, is what makes 7785 ideal for the assembly of parts in the automotive industry.