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Tecbond 263

Polypropylene Adhesive

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Tecbond 263 is a polyolefin-based hot melt adhesive designed to bond polypropylene to polypropylene. The finished bond exhibits excellent heat resistance and good low temperature performance for a non-polyamide adhesive.

Primarily used in the product assembly and manufacturing industries, Tecbond 263 is one of the few 12mm hot melt adhesives that can effectively bond polypropylene.

It’s recommended that Tecbond 263 is applied at temperatures exceeding 200°C with the surfaces compressed as quickly as possible to ensure a strong bond.

Sizes (mm):

12

Categories :

Industrial & Manufacturing, Product Assembly

Chemistry:

PO

Open time:

20 seconds

Application temp:

190-200°C°C

Viscosity / cPs – Adhesive:

10000 @ 180 °C

Softening point:

150°C

Heat resistance:

105°C

Low temp:

-20°C

Colour:

Pale Amber

Tecbond 263

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