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Tecbond 261

High Strength Assembly Adhesive

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Tecbond 261 is a versatile and strong product assembly adhesive with the ability to bond a variety of substrates, including wood, metal, glass, ceramics, and many plastics, including polypropylene. The adhesive’s high bond strength and flexibility also make it ideal for many general-purpose applications.

Along with its high bond strength, Tecbond 261 features a long open time, allowing for the accurate positioning of substrates before compression, at which point the adhesive dries quickly with enough bond flexibility to withstand small substrate movements.

Sizes (mm):

12, 15, 43

Categories :

Construction & Trade, Product Assembly

Chemistry:

EVA

Open time:

30 seconds

Application temp:

130-195°C

Viscosity / cPs – Adhesive:

2500 @ 180 °C

Softening point:

85°C

Heat resistance:

75°C

Low temp:

0°C

Colour:

Pale Amber

Tecbond 261

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