Skip to main content
Markets & Applications

Tecbond 213

General Purpose Flooring Adhesive

Tecbond 213 is an EVA-based general-purpose hot melt adhesive designed to bond substrates commonly used in product assembly applications and the flooring industry.

Excellent bonds can be achieved on ceramics, rigid PVC, hard and soft woods, fabric, and many plastics. Outside of product assembly, Tecbond 213 is also used in the flooring and woodworking industries, thanks to its strong bonding capabilities.

Featuring a high tack and ample open time, Tecbond 213 is one of the most efficient and cost-effective general-purpose hot melt adhesives on the market today.

Sizes (mm):
12, 15, 43
Chemistry:
EVA
Open time:
30 seconds
Application temp:
180-195°C
Viscosity / cPs – Adhesive:
6000 @ 180 °C
Softening point:
90°C
Heat resistance:
80°C
Low temp:
10°C
Colour:
Pale Amber
Tecbond 213
  • Make enquiry

Get in touch