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Tecbond 7718

Potting & Encapsulation Adhesive

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Tecbond 7718 is a polyamide hot melt adhesive designed for potting and encapsulation applications. Available in amber and black, Tecbond 7718 has very low viscosity to improve flow rate with a setting time of around two minutes to speed up production processes.

Tecbond 7718 has been used for many years in the consumer electronics industry to protect electronic components and ensure there is no movement which could cause lasting damage.

Sizes (mm):

12, 15

Categories :

Industrial & Manufacturing, Product Assembly

Chemistry:

Polyamide

Open time:

20 seconds

Application temp:

195-215°C

Viscosity / cPs – Adhesive:

1000 @ 190 °C

Softening point:

160°C

Heat resistance:

115°C

Low temp:

10°C

Colour:

Amber and Black

Tecbond 7718

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