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Tecbond 210

Peelable Hot Melt Adhesive

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Tecbond 210 is a clear, fast setting hot melt adhesive designed to create temporary bonds that are easily removable. Formulated for use on paper, card, and coated surfaces, Tecbond 210 is predominantly used for attaching credit cards, labels, and promotional material to mailing letters, magazine pages or backing cards.

Tecbond 210 has excellent high and low temperature resistance, with bonds being able to withstand temperatures as high as 120°C and as low as -70°C without creeping.

Sizes (mm):

12

Categories :

Packaging & Print

Chemistry:

Rubber

Open time:

<10 seconds

Application temp:

195°C

Viscosity / cPs – Adhesive:

6000 @ 180 °C

Softening point:

150°C

Heat resistance:

120°C

Low temp:

-70°C

Colour:

Off White

Tecbond 210

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