Tecbond 1X

Tecbond 1X is a woodworking and packaging adhesive designed to bond cardboard, paper, and wood substrates. Tecbond 1X has been specifically formulated to have a lower viscosity than many other market comparable adhesives, resulting in better surface penetration and tighter final joints.

Alongside tighter joints, Tecbond 1X’s low viscosity provides excellent output when used with Tec applicators.